Trajectory Planning And Motion Control Base On The IC Chip Die-bonder With Parallel Mechanism

As the key component of the IC dies bonder, the role of Bonding Head machine is to pick up the IC chips which have been cut down into pieces on the wafer, deliver and place them into the lead frame, so it can make sure chips are fixed firmly. The Bonding Head machine needs to fetch between picking and welder point accurately, quickly and stably, realizing picking, delivering and bonding actions.This paper objects in the bonding machine of double slipper blocks parallel plane mechanism of 2-DOF IC dies bonder.In order to realize the quick,precise and steady control of the bonding mechanism, according its working requirements,this paper carries on the research of double slider blocks parallel plane mechanism which includes detailed research of its kinematics, trajectory planning and motion control system.Firstly, this paper introduces the development status of oversea and domestic of die bonder, and discusses the research status and the general methods of trajectory planning. Then, by using the Jacobian matrix, this paper analyzes the singularity of the Bonding Head machine of double slipper blocks parallel plane mechanism, obtains the singularities, describes the working space, establishes the geometric constraint mathematic model and induces the inverse motion equation, which makes the theoretical guidance for trajectory planning.Secondly, based on basic principle of the time-optimal trajectory planning and calculation method of the B-spline curve, according to the working paths, speed and acceleration constraint condition of servo motor, constructing the motion trajectory by using B-spline curve and making use of its characteristics of sectional treatment, this paper finally induces the time-optimal curve equation of motion Trajectory of Bonding Head machine.Finally, the paper uses the motion control experimental platform which is setup by the motion control card and servo motors, configures the system parameters according the experiment requirement, develops the motion control system program by using the VC++ software development platform and motion control card library, and realizes the online controlling of the parallel Bonding Head mechanism.