Study On The Ti/Cu And Ti/Ni Interface Reaction

The diffusion and dissolution of atoms in interface led up to theinterfacial movement and formed a diffusion-dissolution layer, which werealways influenced by the factors such as temperature and time. Diffusioncouples of Ti-Cu and Ti-Ni systems were made by riveting method and thevacuum solid-state diffusion-treatment, and then diffusion-dissolution layerformed which comprises some intermetallic compound and solutionlayers. Ithas been shown by the experiments the following: (1) the interface ofsolutionlayerwithbaseisunclearandunsmooth,buttheinterfaceofsolutionlayer with intermetallic compound layer is very clear and smooth; theinterface of intermetallic compound layer with base is clear and unsmooth,but the interface between intermetallic compound layers are very clear andsmooth due to the componential break; (2) the diffusion-dissolution layer isthick when the temperature is high, and the thickness submits to exponentialincrease relationship with the temperature;(3) the diffusion-dissolution layeris thick when the diffusion-treated time is long, and the thickness kept agreewith parabolic increase relationship with time; (4) the activation energy andthe empiricalformulahasbeencalculated.