Investigation On The Technique Of Acid Bright Copper Plating

When adding some suitable additives to the plating bath comprsing of CuSO₄ andH2804, bright copper plating coat can be obtained. Because of the excellent tenacity andductibility, the good electric conductivity and thermal conductivity, the low porosity, and thenoblest color, bright acid copper plating is widing applied in the filed of electronic, renderingand ornamental plating.At present, the key technique of the bright acid copper plating is to improve the coveringpower and intensity of the area where the current density is low. In this dissertation,wedeveloped a set of additives, especially a kind of additive which can provide excellentcovering power and intensity of the area, where the current density is low, to the plating bath.And the optimum parameters and conditions of this plating technique have been established.(1) For the plating bath containing much CuSO₄ and little H₂SO₄ 98ï¼…H₂SO₄(ml/L) 30～60 CuSO₄·5H₂O(g/L) 160～220 Cl^-(rag/L) 60 H1(g/L) 0.0002～0.0008 SP(g/L) 0.016～0.02 P(g/L) 0.05～0.20 OP-21(g/L) 0.005～0.02 BCU Dyes(ml/L) 0.10～0.20 T(℃) 15～35 Jc(A/dm²) 1～10 Anode Copper anode containing phosphorus(2) For the plating bath containing much H2SO4 and little CuSO4 98ï¼…H₂SO₄(ml/L) 75～100 CuSO₄·5H₂O(g/L) 60～80 Cl^-(mg/L) 60 Hl(g/L) 0.0004～0.001 SP(g/L) 0.018～0.026 P(g/L) 0.05～0.20 OP-21(g/L) 0.005～0.02 BCU Dyes(ml/L) 0.10～0.30 T(℃) 15～35 Jc(A/dm²) 1～8 Anode Copper anode containing phosphorusThese two kinds of the bright acid copper plating baths have excellent covetingpower. Bright plating coat can be obtained even at the area where he current density is verylow by Hull Cell experiments and the coveting power can reach at 100% in the inner bore testand right-angle cathode test. Both of the two kinds of the baths have good dispersing power.In this dissertation, the effect of the additives in the plating bath has been investigated byelectochemical measures and the performance of the plating bath and plating coat has alsobeen tested and proved. And the preproduction showed that the technique can meet therequest of the practical production. So it can be applied to practice.The additives and technology of acid copper plating developed in the dissertation are ofgreat market potential and are deserved being applied widely.