The Research On The Growth Of Order Array With Micro/Nanoscale By Copper Electrodeposits

In recent years, preparations for specific nano-structure have always been the major concern. The ultrathin liquid layer electrodeposits can prepare submicron and nano structure, which is hard to achieve by conventional methods. This method has already been a promising way to fabricate micro/nanostructures with an ordered twodimensional (2D) pattern. Such patterns on different substrates have been the focus of many investigations due to their potential for applications in microelectronics, optoelectronics,magnetoelectronics, and biochemical sensing.Among the methods used for the fabrication of wire patterns, template -assisted and self-organization techniques are two general methods for achieving patterned electrodeposition. Though template method, arrays of metallic nanowires can be fabricated. However, an ordered template over a large area is extremely difficult to prepare.In an ultrathin electrolyte layer, the electrodeposits may have a very low branching rate and the branches may selforganize into regular arrays of metallic micro/nanoscale wires.In this paper, we described the forming process of ordered array by copper electrodeposits, and parallel arrays of micro/nanoscale-width copper wires with Cu/Cu2O nanograins by electrodeposition over a large silicon substrate, without imposed templates and induced additives. Through SEM, TEM and XRD exam, it has been found that the content of Cu is higher than the content of Cu2O, and the micro-mechanism was analyzed. We summarized the two factors for the parallel arrays of copper nanowires One is the charges at the tips of the copper wires should be distributed in such a way that the potential gradient over the tip surface is more or less uniform to ensure a continual growth of the tips in a parallel fashion.The second factor is the balance condition which requires both the cations and the charges depleted at the growing interface to be equal to their corresponding amount replenished.The thickness, width of the micro/nanoscale copper wires and the separation of the neighboring wires can be controlled by varying the concentration of CuSO4. The higher concentration of solution, the thicker of the deposit, and so the width of the nanowires, meanwhile the distance to the copperwire and critical voltage also increased.MATLAB simulation shows when the applied voltage reaches the critical value and the condition is optimum. Firmly arranges the boundary condition, equipotential distribution map near the tips of a regular copper wire array.Although our present report is on the fabrication of Cu wire arrays, similar techniques with slight experimental modifications can potentially be applied to the formation of other materials filament arrays, such as Co, Ag, and Pd, which are interesting materials for magnetic recording media and photoelectric devices. The method offers a very simple yet reliable technique, which can be used to fabricate various micro/nanowire devices. We expect that these metallic-wire arrays may have potential applications in microelectronics and optoelectronics.