Study On Micro-machining Technology Using Abrasive Water Jet

Micromachining is one of the precision machining technologies. It means the technology of producing with parts micro size. Waterjet is a new precise and cold machining process. Micromachining technology is one of the important research subjects on the modern machining technology. It plays a vital role in the improvement of advanced manufacture.A systematic research on micromachining, waterjet technology and mechanism of abrasive water-jet were carried out in the thesis. Typical micromachining technologies were analyzedand compared. After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward. Because there is no heat-affected zone and it can achieve high cutting precision, abrasive waterjet is superior to traditional manufacturing, especially in semiconductor industry. In addition, omni-directional cutting can be made by waterjet, therefore it is better than traditional diamond saw cutting.Based on current waterjet machining, the experiments on semiconductor material cutting using abrasive waterjet, were carried out. The study on the feasibility of cutting semiconductor using waterjet is demonstrated. On the other hand, the phusical or chemical changes of work piece as well as the influences on IC performance after waterjet cutting are tested.The research indicates that the process of semiconductor cutting will be optimized by abrasive waterjet micromachining. The working temperature is lower than 100℃. Abrasive waterjet cutting has effect on the surface finish. It can't destroy the internal structure of work pieces except for obvious kerf. In the end, it demonstrates that micro-abrasibe waterjet can be used to cut semiconductor materials.The results studied in the thesis have significant academic value and good applications in micro-machining of semiconductor chips.