The Study Of ELID Grinding With The Method Of Molecular Dynamics Simulation

ELID(Electrolytic In-process Dressing)grinding technique is based on the principle of electrochemical machining and electrolytic grinding technology. The technique combines the dressing of grinding wheels with the grinding process. In the course of grinding with the minute cutting of grinding wheels, the wheels are also being dressed by the nonlinear electrolysis. Thus, the phenomena of passivation and obstruction are avoided and the ultraprecision mirror grinding of hard and brittle materials is achieved. However, the lack of all-around understanding for the mechanism of EILD grinding limits its further advance. The Molecular Dynamics Simulation (MDS) is one of the new methods in computer simulation, which can explain the machining mechanism that can't be made clear by the tradition approaches of experiment and theory. In this paper, MDS is related with the study of the mechanism of EILD grinding.。The grinding process of monocrystal silicon is simulated in order to have an all-round understanding of its mechanism and try to ameliorate the grinding conditions according to the result of the simulation.First, the history and basic theory about MDS is introduced. The emphases are put on some aspects as follow: the establishment of the motion equation, the selection of potential function and the process of algorithm. Then, based on these theories, the three-dimensional model with using monocrystal silicon as the workpiece is built and the processes of different grinding deepness is studied. The Newton's equations of motion are established and solved utilizing the Tersoff potential function. According to the result of the simulation, the forming mechanisms of the chip and surface machined in the atomic point of view are given, and the changes of the grinding force are also studied. At last, the effects of the passivation layer are analyzed .in this paper, the iterative processes are done between the model of the molecular dynamics and the model of the finite element analysis. The changes of the grinding granule's position are given. According to the result, the passivation layer can improve the conditions of the coequal highness and increase the precision of ELID grinding.