Study On Technology And Mechanism Of Removing Oxide Film During Vacuum-Free Vibration Liquid Phase Diffusion Bonding Of SiCp/ZL101A Composites

Dynamic equilibrium process for pushing and drawing in of part of filler metal at the edge of gap and removing behavior of oxide film were investigated during vacuum-free vibration liquid phase diffusion bonding, taken particulate-reinforced SiCp/ZL101A composites as the research object. Removing oxide film and microstructure of the joint were analyzed. Furthermore, the rheological behavior during vibration was discussed through the semi-solid alloys theory, in order to discuss the reason of the disequilibrium and the physical process of removing oxide film preliminary.This paper discussed the regularity of the maximum time of dynamic equilibrium maintain following with the temperature, filling coefficient of the solder, vibration amplitude and frequency.With temperature rising, the proportion of the solid crystal grain decreases, the solid crystal grain approaches to round and the size decreases, so the non-deformability decreases and the liquidity increases. With time rising, the proportion of the grain decreases, the solid crystal grain approaches to round and the size decreases, and the grain change into little crystal grain at last. During the vibration, the solid proportion of the center is more than the edge, so the marginal liquidity is better than the center.When the filling coefficient of the solder is 0.85, the oxide film remained in interface is least when vibration amplitude is 700μm; With frequency rising, the remained oxide film in interface decreases; With time rising, the remained oxide film in interface decreases. Physical model of the disruption of the oxide layer is established based on the experimental results.