The Research On Properties Of SiC_p/Al Composite For Electronic Packaging

The SiCp(55vol%)/Al composites were fabricated by pressureless infiltration for electronic packaging applications.The SiCp/Al composites which include different SiC particle diameter(220μm,140μm,90μm and 70μm),different SiC particle shape(irregularity and sphericity), different particle matrix(1060,ZL101A,ZL104 and ZL102)were fabricated.The microstructure and interface characteristic of SiCp/Al composites were observed and analyzed by OM and TEM.The thermophysical and mechanical properties of SiCp/Al composites were tested by thermal dilatometer, laser flash thermal conductivity apparatus and electronic mechanical testing instrument.The thermal residual stress of SiCp/Al composite was analysed by using the finite element method.The textural stress of composite was measured by XRD,and effects of thermal residual stress on expansion behavior were discussed.The results show, the SiCp/Al composites with high densification and microstructure homogeneous can be fabricated by pressureless infiltration.TEM observations indicate that new component does not appear at interface around SiC particles.Some factors can reduce thermal expansion coefficient of SiCp/Al composites such as biger and sphericity of SiC particles, more content of Si in matrix and annealing treatment.Some factors can improve thermal conductivity of SiCp/Al composites such as small and phericity of SiC particles, proper content of Si in matrix and annealing treatmentm.The SiCP/Al composites have high thermal residual stress at room temperature which were calculated by Ansys.The maximum stress distribute interface of composites.There are tensile stress in matrix and compressing stress in reinforcement particles.Some factors can improve hardness of SiCp/Al composites such as small of SiC particles, more content of Si in matrix and ageing treatmentm. Some factors can improve bending strength of SiCp/Al composites such as small of SiC particles, less content of Si in matrix and ageing treatmentm.SEM observations show that microscopic fracture of composites in annealing condition and ageing condition have different mechanism.SiC particles of composites in annealing condition...