Study On The Modification Of Epoxy Resin System For Wet-Winding

In order to meet the requirements of wet-winding, 4,5-epoxycyclohexane-1,2- dicarboxylate (TDE85) and 4,4'-diaminodiphenylmethane (DDM) were selected as the resin matrix and the curing agent. DDM was modified by diluents such as butyl glycidylether(660), polypropylene glycol diglycidyl ether(207), vinyl cyclohexane diepoxide(206) and N,N'-dimethyl-formamide (DMF) so as to improve the processing properties of the epoxy resin. The resin system was mixed with organic silicon at the aim of improving the mechanical properties of polymer condensation. The influence of the modification conditions of DDM on the processing properties of the resin system were amply studied,so did the affection of epoxy resin blended with organic silicon to the properties of condensation. To study the curing dynamic principle and characterize the structure and properties of the modifier and polymer condensation, the methods of DSC, IR and SEM were used. The results indicated:DDM modified by 207 and DMF, while the ratio of 207, DMF and DDM was 15:10:40 ,the viscosity of the modifier 207GDDM was 0.105Pa·s at 28℃. While the ratio of TDE85 and 207GDDM was 18:13, the initial viscosity of the resin system was 0.34Pa·s and the pot life was 8hr at 28℃which met the demand for wet-winding process. The cure schedule was 90℃/2h + 120℃/1h + 160℃/ 3h. The tensile and flexural strength were 93MPa and 132MPa. The casting strain to failure and the Tg of the condensation were 7.0% and 111℃.DDM modified by 206, while the ratio of 206 and DDM was 25:40, the viscosity of the modifier 206GDDM was 0.1Pa·s at 28℃. And the TDE85:206GDDM was 14:13, the initial viscosity of the resin system was 0.34Pa·s and the pot life was 8hr at 28℃which met the demand for the wet-wingding process. The cure schedule was 90℃/2h + 120℃/1h + 160℃/3h. The tensile and flexural strength were 102MPa and 150MPa. The casting strain to failure and the Tg of the condensation were 4.1% and 151℃.TDE85 toughened by organic silicon, the 206GDDM was used as the curing agent and the cure schedule was 90℃/2h + 120℃/1h + 160℃/3h. When the mass percent of organic silicon is 5%, the tensile strength and the casting strain to failure of the condensation were 110MPa and 5.83% which increased by 7.8% and 42% respectively compared with the non-organic silicon...