Study On The Meltblown Nowovens Process And Mechanism Of The Low Melt Point Copolyamide

The new nonwovens materials of the low melt-point copolyamide are made and mainly studied in this paper. The meltblown process and technology of low melt point copolyamide and web film thermal bonded property of nonwoven are discussed. The meltblown model of mathematics is made in terms of the characteristic of low melt point copolyamide and many kinds of influence factors of experiment is also analyzed.Considered its application, thermal bonded process and influence factors of press condition to peeling intensity are analyzed.The low melt-point polymer was made by shanghai ATOFINA gaoyuan chemical co.,Ltd. The melt point of sample 1 and 2 is 104℃ and 120℃ ,respectively. First, the basic property of sample was tested, the conclusion was reached by the analysis of the result that the low melt point copolyamide is fit to meltblown experiment regardless of the temperature's great effect on the characteristic of polymer. Second, the big improvements upon the present meltblown equipment system is made on basis of the characteristic of polymer and it is found that the quality of nonwovens web film made in the later meltblown equipment system increases markedly.After long time's research, the experiment parameter effects on the characteristic of web film are shown as follow.The mean fiber diameter in the film decreases with increasing of the die temperature, the die to collector distance(DCD) and the attenuating air pressure, and withdecreasing of polymer throughput. The fiberweb density coefficient of mean deviation increases gradually when polymer throughput increases gradually, yet first increases and then decreases when the die to collector distance(DCD) and the attenuating air pressure increase. The fiberweb longitudinal strength increases as the polymer throughput increases and the die to collector distance(DCD) decreases, and first increases and then decreases as the attenuating air pressure increases.The mathematical model is established in terms of polymer performance and specific technical condition. By comparing the theoretical diameter and practical one, the conclusion is reached that the model has good prediction on fiber diameter.The low melt point copolyamide web film thermal bonded process and the adhesivity related to many fabrics are also studied in the paper. The following are the conclusions reached after the experiments and analyzing: the better pressing condition- press temperature 140 癈 , press fore 1.25kgf/cm2, press time 20 s, the peeling strength first rising and then dropping with rising of the press temperature, and the peeling strength rising with rising of the press force and time.The conclusions are reached after thermal bonded experiments to different materials: the low melt point copolyamide web film adhesive has good cohesive action against cellulose fiber material, and has selectivity to polyester material- good cohesive action to fiber coarseness surface but bad action to slippery surface. Hence, the web film adhesive can replace adhesive in the market in cellulose fiber material.Finally, the low melt point copolyamide thermal stability is researched and the conclusion is that the low melt pointcopolyamide is fit to meltblow under the temperature 50℃ above its melt point. Coherence research about meltblown process upon low melt point copolyester is made in the end.