Elastic—Plastic—Creep Computational Analysis & Reliability Evaluation Of Ball Grid Array Solder Joint In Cemaric Quartz Chip (CBGA)

Surface Mount Technology (SMT) now is a kind of continually developing polytechnic prevalent in electronic industry. In this dissertation,elastic-plastic-creep analysis & reliability evaluation is carried out to study cemaric ball grid array solder joint.Tin-lead solder now is used in SMT industry generally. There is 40 percent lead in Tin-lead solder. As we all known,lead is poisonous metal,and it will have bad effect on human being & circumstances. Free-lead solder should be used in SMT industry,for getting rid of disadvantage of lead. In this dissertation,generalized hybrid/mixed finite element analysis is carried out to study the elastic-plastic -creep character of tin-lead and free-lead solder,and three different reliability evaluatin methods is applied to evaluate their thermal fatigue life in some temperature model (referring to dwell-creep model). Then which solder is best fit for this model and the influence on fatigue of solder are known,when free-lead solder is used.In this dissertation,a tool software based on theory of probability is developed to deal with reliability of simple system. Sketch map and computation of simple reliability system can be finished by using the software. The software is a tool for studying of simple reliability system in SMT industry in future.The works done in this dissertation may benefit the prediction of fatigue reliability,choice of solder and influence of free-lead solder on reliability of solder joint,and have some merits on dealing with reliability of simple system.