Investigation Of Stress In Diamond Films

Diamond films has broad application prospects. As the stress is a common phenomenonin the preparation and application of the films, which weakened the bond strength betweenthe diamond film coating and the substrate, limiting its application. The studies of CVD(Chemical Vapor Deposition) diamond films stress close tied to the film growthmechanism, should be linked up in an analysis and research.DC-PCVD method used to preparation the diamond films, study the methane flow rate, the discharge current on the growth characteristics of diamond films and film quality. And then studied the different conditions of preparation on the burst strain of diamond films, through its XRD and Raman spectra, found: 1 .The micro-tensile stress of diamond films with the methane flow rate or the discharge current increases, the quality of diamond films deteriorated, but the micro-tensile stress in high-end power has a downward trend, so to improve the quality of the diamond films. 2.The macro-stress with the methane flow rate (discharge current) increase (reduced), resulting the quality of the diamond films lower(raise).3.With the substrate temperature raised, the diamond film intrinsic stress larger, and the internal stress reduced. Finally, the study of the point of the stress found: the substrate temperature is the main reason of the micro-crack and burst phenomenon in the diamond films deposition process.