During the growth process of semiconductor thin films, the thin films properties, such as thin film stress, growth rate, thickness, refractive index etc, are always needed to measure in real time in order to precisely control their growth process. Domestic measuring technologies on thin film properties are almost off-line and foreign measuring devices mostly aim to measure individual property. On the basis of international broad research on thin film measuring technologies, the in-situ measurement blueprint of thin film multi-properties based on the integration of multi-beam light deflection method and reflected light interference method is conducted. At the same time, the relative device is designed and the feasibility that it can be used to measure thin film multi-dot stress, growth rate, thickness, refractive index etc. in real time is demonstrated in detail.As to the practical engineering work, many main parts of the device including thin film in-situ stress array sensor, output power highly stable and tunable LD, low-noise and high precision light intensity data acquisition and transmission module, thin film properties calculating software etc, have been analyzed and designed. At last, part experiments and conclusions are given and the further research and improvements needed to do in the near future are expected.
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