Dry silver electromigration process for optical glass waveguide fabrication and fluxless bonding technology for photonics and MEMS packaging

An effectively simple dry silver electromigration technology without the need of evaporating separate gold or aluminum film electrodes onto both sides of glass is reported to fabricate low-loss deep multimode planar and channel waveguides on BK7 and BF450 glass substrates. A relatively high electrical field ranging from 440 to 545 V/mm was applied to the glass to speed up the migration, while at the same time preventing silver ions that were driven into the glass from reducing into silver atom; a major contributor to waveguide loss. The deep planar and channel waveguides thus fabricated showed no discolors or cracks, of which the attenuation losses of less than 2dB/cm and 0.1dB/cm were later measured from channel waveguides constructed on the BK7 and BF450 glass substrates, respectively, using our 0.6328μm He-Ne laser edge-coupling setup. To complete the waveguide studies, the scanning electron microscope (SEM) equipped with energy-dispersive X-ray (EDX) detector was adopted to obtain the concentration profiles of silver and sodium ions distributed in a waveguiding region after the exchange. The EDX measurements acquired hereafter were then utilized along with the Gladstone-Dale relation altogether to deduce the refractive index profile; of which a nearly step-like profile was consistently deduced from every deep planar and channel waveguides fabricated. Finally, a numerical model utilizing the space charge approach was devised to explain the nonlinear current effect often observed during the actual waveguide fabrication. The simulation results have confirmed that the nonlinear current-versus-time profile obtained is mainly attributed to the inhomogeneous distribution of the electric field in the glass substrate due to a space charge region created by the separation between silver- and sodium-ion migration fronts as a result of their unequal mobilities; a phenomenon which is ultimately responsible for the eventual slow down in the ion exchange rate as monitored during the actual electromigration process.; A fluxless oxidation-free bonding technology using multilayer composite solders based on the non eutectic binary alloys of indium-tin (In-Sn), silver-indium (Ag-In), gold-tin (Au-Sn), and bismuth-tin (Bi-Sn) has been established and studied to determine its applicability to photonics and MEMS packaging. The scanning acoustic microscopy (SAM) conducted on these solder samples has consistently shown that a nearly void-free joint fabricated from each non-eutectic binary alloy system can be reliably achieved. In addition, the scanning electron microscopy (SEM) equipped with the energy dispersive X-ray (EDX) detector was also performed on the cross section of each sample to determine its joint composition, especially of any sign of intermetallic compounds. These results will demonstrate that any intermetallic compound or phase present in a joint fabricated with a pre-determined multilayer composition based on a specific binary alloy system can be well understood and fully justified by correlating the experimental outcome with its respective binary phase diagram.