Comparison of high speed impact test of solder joints with board level drop test

Efforts have been made in this study to evaluate the characteristics of solder joint failure by using a new high speed impact tester. First, the dynamics and characteristics of the test vehicle in a board level drop test have been evaluated. A thorough understanding of the behavior of the test vehicle is examined by characterizing its response under different test profiles and board dimensions. This is done in an attempt to optimize the test procedure used to qualify electronic products subjected to high strain rate drop/shock environment. The effects of peak acceleration and change in velocity of the impact pulse on the reliability of the test vehicle have been studied. In situ strain measurements have been used to aid us in characterizing the board response under high strain rate loading conditions. Also finite element analysis has been used to better understand the board response under different loading conditions. Based on the experimental results and analysis, ways to improvise the drop test setup have been discussed. A more thorough understanding of the solder joint behavior is examined by characterizing the behavior with respect to varying impact profiles on a new pendulum fatigue and a high speed impact tester. This is done in an attempt to address solder joint failures in actual product that may be operating under high strain rate or shock environments and to reduce the actual test time needed for a board level drop test. Comparison between the high speed pendulum impact test and drop test was primarily made by evaluating the failure modes from these two tests. Energy absorbed by the solder in a single impact has been used to predict the reliability in a board level test.