Materials, design and processing of air encapsulated MEMS packaging

This work uses a three-dimensional air cavity technology to improve the fabrication, and functionality of microelectronics devices, performance of on-board transmission lines, and packaging of micro-electromechanical systems (MEMS). The air cavity process makes use of the decomposition of a patterned sacrificial polymer followed by the diffusion of its by-products through a curing polymer overcoat to obtain the embedded air structure. Applications and research of air cavities have focused on simple designs that concentrate on the size and functionality of the particular device. However, a lack of guidelines for fabrication, materials used, and structural design has led to mechanical stability issues and processing refinements.;This work investigates improved air gap cavities for use in MEMS packaging processes, resulting in fewer fabrication flaws and lower cost. The identification of new materials, such as novel photo-definable organic/inorganic hybrid polymers, was studied for increased strength and rigidity due to their glass-like structure. A novel epoxy polyhedral oligomeric silsesquioxane (POSS) material was investigated and characterized for use as a photodefineable, permanent dielectrics with improved mechanical properties. The POSS material improved the air gap fabrication because it served as a high-selectivity etch mask for patterning sacrificial materials as well as a cavity overcoat material with improved rigidity. An investigation of overcoat thickness and decomposition kinetics provided a fundamental understanding of the properties that impart mechanical stability to cavities of different shape and volume. Metallization of the cavities was investigated so as to provide hermetic sealing and improved cavity strength. The improved air cavity, wafer-level packages were tested using resonator-type devices and chip-level lead frame packaging. The air cavity package was molded under traditional lead frame molding pressures and tested for mechanical integrity. The development of mechanical models complimented the experimental studies. A model of the overcoat materials used the film properties and elastic deformations to study the stress-strain behavior of the suspended dielectric films under external forces. The experimental molding tests and mechanical models were used to establish processing conditions and physical designs for the cavities as a function of cavity size. A novel, metal-free chip package was investigated combining the in-situ thermal decomposition of the sacrificial material during post-mold curing of the lead frame molding compound. Sacrificial materials were characterized for their degree of decomposition during the molding cure to provide a chip package with improved mechanical support and no size restrictions.;Improvements to the air cavities for MEMS packaging led to investigations and refinements of other microfabrication processes. The sacrificial polycarbonate materials were shown to be useful as temporary bonding materials for wafer-level bonding. The release temperature and conditions of the processed wafer can be changed based on the polycarbonates formulation. The electroless deposition of metal was investigated as an alternative process for metalizing the air cavities. The deposition of silver and copper using a Sn/Ag catalyst as a replacement for costly palladium activation was demonstrated. The electroless deposition was tested on polymer and silicon dioxide surfaces for organic boards and through-silicon vias.