Enhancement of saturation boiling of PF-5060 dielectric liquid on microporous surface

This research experimentally investigated microporous Copper (MPC) surfaces for enhancing nucleate boiling and increasing the Critical Heat Flux (CHF) of PF-5060 dielectric liquid and the potential application of the results to immersion cooling of high power computer chips. MPC surfaces of different thicknesses (80-230 mum), fabricated using conventional electrochemical deposition at high current density, have different morphology and microstructure. The PF-5060 liquid is chemically inert, environmentally friendly, and has low enough saturation temperature (∼ 54oC at 0.10 MPa). This helps maintain the chip junction's temperature below that recommended by the chip manufacturer (85-120 °C, depending on the application).