| The fabrication and characterization of novel gallium nitride based micro-cavity light emitting diodes is presented. A fabrication process was developed for creating a GaN light emitting diode within a micro-cavity of controllable thickness. The benefits of this structure can be enhanced light extraction efficiency, brightness, spectral purity, and directionality. The fabrication process involves flip chip processing, laser lift-off, and cavity thinning by inductively coupled plasma etching of the nitrogen faced GaN. Using these methods GaN based micro-cavity light emitting diodes were fabricated with cavity thicknesses as low as 350nm. |
