| This document describes hydrodynamic and thermal modeling of two-dimensional microdroplet arrays for use in digitized heat transfer (DHT), a novel active thermal management technique for high power density electronics and integrated microsystems. In DHT, thermal energy is transported by a discrete array of electrostatically activated microdroplets of liquid metals, alloys or aqueous solutions with the potential of supporting significantly higher heat transfer rates than classical air-cooled heat sinks. Actuation methods for dispensing and transporting individual fluid slugs with a high degree of precision and programmability are described, with simple approximate formulae for net forces for steady state and transient velocities in terms of known parameters. A modified cavity flow solver is developed to provide details on the internal flow properties of a translating microdroplet and used to detail the effects of droplet curvature, internal mixing, Peclet number and other parameters on the heat transfer capabilities of a discretized liquid flow. The concept of Nusselt number is generalized to an individual fluid slug and shown to oscillate with a period equal to the droplet's mixing rate. In whole, DHT is demonstrated to be a viable new alternative for achieving the most important objectives of electronic cooling (i.e., minimization of the maximum substrate temperature, reduction of the substrate temperature gradient and removal of substrate hot spots) and a sound fundamental description of the method's electro-, hydro- and thermodynamics is provided. |
