Design Of Packaged Filters In 3-D Millimeter Wave Systematic Integration

Millimeter wave three-dimensional system-on-package(3D-SOP)has received great attentions from both the academia and the industry since the 1990s.Due to the advantages of multi-function,miniaturization,and low cost,Millimeter wave 3D-SOP has been applied to mainstream uses these years.Filter is a very important component in millimeter wave systems,improved efficiency for passive packaging is helpful to the integration of millimeter wave systems.Substrate integrated waveguide is self-packaged.Moreover,folded SIW and quarter=mode SIW are compact in size.This kind of components is very suitable for Millimeter wave 3D-SOP due to avoiding both EMI and EMC problems in dense wiring.By applying BCB as dielectrics,some different kinds of SIW packaged filters are designed and fabricated in this paper.Besides,some relative universal design theories are also investigated and introduced.The detail creative points are listed as follows:(1)A compact self-packaged folded substrate-integrated waveguide(SIW)filter with loaded stubs is presented.Transmission zeros(TZs)at the same number of filter order are designed to inhance the out-of-band rejection.The position of each transmission zero is controlled independently.The first parasitic resonant frequecy increases by up to 3.8 times of the fundamental frequency by suppressing the original first parasitic resonance.(2)A design methodology of multi-TZs on the basis of a traditional Chebyshev filter is first demonstrated in this paper.It increases the attenuations of the filter stopband.A novel quarter-mode SIW packaged bandpass filter with four transmission zeros are designed to verify the proposed idea.In addition,Quarter-mode SIW resonators are analyzed with high-mode suppression by properly setting their feed points.Finally,mode suppressions of up to 110 GHz(3.6 times of center frequency)are realized.The filter offers compact configuration,it has an insertion loss of 2.85 dB at 30 GHz and fractional bandwidth of 20%.By utilizing BCB based MEMS technology,the packaged filter is easily integrated with other devices.The proposed concept is attractive for designing miniaturized and high-performance-packaged filters for three-dimensional millimeter wave transceiver systems.(3)Besides,a novel quarter-mode packaged notch filter with modes suppressions of up to 80 GHz in substrate-integrated waveguide technology is also illustrated.The notch frequency can be adjusted flexibly and transmission zeros are also designed.The measured results validate the good properties of the packaged filter.(4)A novel quintuple-mode filter in one cavity is proposed by modifying a quarter-mode substrate-integrated waveguide cavity.Modes can be independently controlled by dimension parameters of the resonator.The quintuple-mode resonator is packaged to prevent electromagnetic leakage,and pillars are added to remove spurious cavity resonances introduced by the packaging.A W-band filter is designed and fabricated by using benzocyclobutene(BCB)polymer as dielectrics.The other MEMS fabrication technique is applied without lithography of BCB,which realizes through vias in thick BCB substrates.Four TZs are added in the design and the insertion loss is1.97 dB at 89 GHz.The measured fractional bandwidth is 22.5%.Simulated results agree with measured results.(5)Most of the external qualities of a multimode resonator filter are relative.Therefore,the external qualities of a multimode resonator cannot meet the request of a standard Chebyshev filter.Based on coupling matrix theory,a new method is demonstrated to realize an equal-ripple filter even though the external qualities(Q_e)of the multimode resonator are related to each other.