Research On Carbon Nanotubes Interconnect During The Melting Process Of The Solder Using Laser Irradiating AFM Probe

Carbon nanotubes (CNTs) have been viewed as the attractive candidates for the future interconnection wires due to its excellent electrical and thermal performances. CNTs interconnection technology is essential for structure manufacturing and functional devices integration to obtain the effective mechanical connection, electrical connection, electrical insulation or other special properties. With the development for high power, high density, high reliability and green packaging of CNTs products, for excellent electrical and thermal performances, CNTs will play an important role in the future interconnection process. For excellent electrical, thermal and mechanical properties, soldering technology has been proven to achieve effective interconnection between CNTs and metal electrodes. However, the interconnection between CNT and CNT are rarely reported, and the size of joints is relatively large. For the next generation of manufacturing and application of novel nanoscale devices and structures, the new integration scheme between optical probe laser and AFM probe was proposed for the interconnection study between CNTs. The main contents are as follows.As the coupled field between optical fiber probe and AFM probe, the near-field theory was studied. And the theoretical and computational model of optical near-field was built based on near-field optics and electromagnetic theory. The enhanced near-fields of optical fiber probe, AFM probe and their integration were analyzed, and the impact parameters of geometry and laser on near-field enhancement were explored. Based on the electromagnetic and thermal theory, the simulations about AFM probe irradiated by laser were performed, which provides the theoretical basis for nanosoldering process using AFM probe heated by laser.For the nanosolders melting and interconnecting CNTs, the melting process of nanosolders and the size effect on melting temperature were studied. So the simulation model for interconnect between CNTs was built, and the nanosoldering process of axially positioned CNTs was analyzed through the simulation results with exploring correlative mechanism. At the same time, the simulation study of CNTs with X, Y, T junctions during nanosoldering process was also performed with the effect on interconnection about temperature, time and other factorsTo effectively achieve the positioning of nanosolders, the experiments about nanosoldering deposition were performed based on combined-dynamics “dip-pen” nanolithography, and the impacts of relative humidity, roughness, hydrophilicity and other factors on deposition were studied. According to the relationship between AFM cantilever mass and resonance frequency, the quantitative deposition was also theoretically discussed. At the same time, positioning operation was studied based on vector scanning mode, and the nanosolders and CNTs were successfully operated to the specified position.For the interconnect of CNT using AFM probe heated by laser, the experimental interconnect system was developed with optical fiber probe laser irradiating AFM probe. The temperature calibration experiments about AFM probe irradiated by laser were performed based on the surface melting characteristics of single crystal materials and polymers. And the nanosolders melting and interconnectiing CNTs processes were achieved. The research results show that the nanosoldering method using AFM probe irradiated by optical fiber probe laser is feasible for the CNTs interconnect, which provides a new way for nanointerconnection.