Moisture Control Solution For LF&HF FCBGA&Thermal Applications Of Nanocrystalline Diamond Film

This study focuses on the moisture absorption and desorption of Lead-Free&Halogen-Free Flip Chip Ball Grid Array (FCBGA) packages on the product manufacture line. The moisture related packaging failure mechanism induced by the challenging Lead-Free and Halogen-free process was discussed. A series of moisture absorption and desorption data were collected from FCBGA package assembly/test environment. The packaging simulation was established and the moisture diffusion rate of packaging raw material and FCBGA unit level were calculated. The results were fully matched with experimental results. Through low Relative Humidity (RH) conditions, the novel room temperature’soft desorption’solution can be applied for extending manufacture’s exposure time (MET) by lowering the residual package level moisture without any heat. Fundamental moisture desorption behavior and reliability stress test for these novel methods were investigated along with typical bake process for packages exposed under manufacturing RH conditions. The reliability result proved the accuracy and executablility of manufactory line. It is believed that this’soft desorption’concept can be widely used in High Volume Manufacturing (HVM) to eliminate moisture related reliability problems on LF&HF FCBGA packages and other moisture sensitive electronic products.Due to the diamond’s highest thermal conductivity and other excellent properties, there has been a long standing desire for integrating diamond with silicon for issues such as thermal management on microprocessors. This study focuses on the hot filament chemical vapor depostion (HFCVD) technology of the Nanocrystalline diamond (NCD) films under different temperature (600℃,620℃,640℃å'Œ660℃). The effect of deposition temperature on surface roughness of nanocrystalline diamond film was discussed. The AFM and Raman analyses proved that deposition temperature has a great effect on the surface roughness and quality of NCD films and620℃is the temperature to grow NCD films with smooth surfaces. The thermal performance of the Nanocrystalline diamond films was measured. The test result demonstrated that this nanocrystalline diamond film had smoother surface and better heat performance as the future heatsink material.