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21. Simulation Of Electromigration And Size Effect On Interfacial Reaction In Lead-free Solder Joints
22. Study Of Microstructural Evolution Of Narrow Gap Cu/Sn-Cu-Ni-xRE/Cu Solder Joints And The Size Effect On Their Mechanical Properties
23. Numerical Simulation And Design Of Experiments Of Thermo-mechanical Stress For Through Silicon Vias Interconnect
24. Research On Joint Shear Properties And Interface Structure Of BGA Solder
25. Study On The Preparation And Performance Of The T Type Thin-film Thermocouple
26. Research On Mathematical Modeling And Accuracy Performance Of Parallel Type Six-axis Accelerometer
27. Viscous Drag Reduction Based On Size Effect For Micro-gyroscope
28. Mechanical Analysis Of Mesh Woven Structure
29. The Study Of Resonance Characteristics Of Silicon Nanowires Based On Molecular Dynamics Simulation
30. Influence Of Joint Size And TiO2 Nanoparticles Dopant On Interfacial Reaction Of Micro-solder Joints
31. Influence Of TiO2 Nanoparticles Addition And Joint Size On Interfacial Reaction Of Lead-free Microscale Solder Joints
32. Study Of SAC/Cu Micro Solder Joints Plastic And Creep Performance
33. Research On The Two Dimensional Semi-analytical Of Fully-depleted SOI MOSFET In Sub-threshold Region
34. Analysis On The Coupled Vibrations And Frequency Shift Of A Compound System Consisting Of A Quartz Crystal Plate And Surface Structures In Liquid Environment
35. Theoretical Study Of Surface/interface Effect On The Phonon Properties And Thermal Performance Of GaN Nanofilm
36. Geotechnical Parameter Integration Of Communication Facilities Construction
37. Study Of A New Method And Related Effects For Wafer Level Uniaxial Strain SOI
38. Research On Sensors Based On Copper Oxide Nanomaterials
39. Flexible And Extensible Semiconductor Terahertz Modulator
40. Finite-size Analysis Of Continuous-variable Quantum Key Distribution
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