Keyword [thermocompression bonding] Result: 1 - 6 | Page: 1 of 1 1.  A Study Of The Preparation And Properties Of High-temperature Joint With Porous Copper As Interlayer 2.  Study On Vacuum Thermocompression Bonding System Of Polymer Microfluidic Chip 3.  Fundamental Research On Nano Thermocompression Bonding Technology 4.  Research On Multi-parameter Integrated Sensing Technology Based On SAW Resonator 5.  Study On Low Temperature Cu-cu Bonding Based On Graphene/lead-free Solder 6.  Research On The Process Parameters Of Thermocompression Bonding And Droplet Generation Of Polymer Microfluidic Chip   <<First  <Prev  Next>  Last>>  Jump to

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