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Keyword [stress migration]
Result: 1 - 11 | Page: 1 of 1
1.
Coupled Mechanical/Electrical Failure In Thin Film Interconnects Under Electromigration
2.
The Study On The Reliability Of The Copper Interconnection In ULSI
3.
Research On Reliability Problems Of Copper/low K Interconnects
4.
Research On Si
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4
Hillock Defect In Damascene Technology Of Copper Interconnect
5.
The Impact Of The Manufacturing Process Of Ultra-deep Sub-micron Aluminum Interconnects Through-hole Stress Migration Reliability
6.
Failure Mechanism And Reliability Analysis Of Cu Interconnect Structures Under Thermal Stress
7.
The Analysis And Research Of Cu Interconnection Failure
8.
Finite Element Simulation Analysis For Copper Interconnect Reliability
9.
The Evolution Of Intragranular And Transgranular Microcracks Induced By Electromigration And Stress Migration
10.
The Evolution Of Microcracks In Interconnects Induced By Stress Migration
11.
Modeling of electromigration and stress migration in copper interconnects prepared by chemical-mechanical polishing
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