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Keyword [stress intensity factor]
Result: 1 - 5 | Page: 1 of 1
1.
Viscoelastic Fracture Research Of Flip Chip
2.
The Research Of Cutting LCD-glass With Thermal Cracking Method Based On Thermal Weight Function Technology
3.
Research On Dicing Of Glass/Silicon Multilayer Bonding Plate Based On Laser Induced Thermal-crack Propagation
4.
Study On Processing Technology And Mechanism Of Laser Thermal Cleavage Wafer Under Water Cooling
5.
Plane Grid Generation And Dynamic Response Analysis Based On A Structure Analysis Software SASS
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