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Keyword [solder layer]
Result: 1 - 17 | Page: 1 of 1
1.
Thermal-Structural Analysis Of Electronic Components
2.
Reliability Analysis And Thermal Resistance Degradation Of High Power Devices In The Long-term Harsh Environment
3.
Research On Reliability Of IGBT Power Module Packaging
4.
Study On Failure Mechanism And Fatigue Damage Of The Solder Layer In The IGBT Module Considering Cumulative Damage
5.
Study On The Thermal Stress Distribution And Its Relevance With The Lifetime Of IGBT Module
6.
Study On Lifetime Evaluation Of IGBT Modules Based On Transient Thermal Impedance
7.
Reliability Analysis Of IGBT And Research On Circuit Simulation Model
8.
Research On Reliability Of CSP LED Solder Layer
9.
Research On The Thermal Effect Of Electromagnetic Damage And The Thermal Reliability In IGBT
10.
IGBT Module Failure Modeling And Simulation Based On Multi-physical Field Coupling
11.
Coupling Failure Analysis Of Electro-Thermal-Mechanical Multiphysics Based On IGBT Dynamic Model
12.
Study On Fatigue Failure Mechanism Of IGBT Module's Solder Layer
13.
Research On Damage Condition Monitoring Of IGBT Module Packaging
14.
Failure Analysis Of Power Device IGBT Under High Temperature Vibration Condition
15.
Construction Method Of Bidirectional Thermal Network Model Considering Solder Layer Damage Of IGBT Module
16.
Research On SiC MOSFET Degradation Under Accelerated Stress
17.
Research On Physical Lifetime Prediction Model Of IGBT Module For Solder Layer Fatigue
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