solder joints - Globe Thesis

Keyword [solder joints] Result: 21 - 40 \| Page: 2 of 5
21.	Lead-free Solder Joint Reliability Under Thermal Load Electrical Measuring Methods Research
22.	Temperature Resistance Strain Characteristics Of Lead-free Solder Joints Under Thermal Load And Stress-strain Simulation,
23.	Shear Resistance Strain Of The Solder Joints Under Tensile And Temperature Cycling Conditions
24.	Damp Heat Load Of Lead-free Solder Joint Resistance Strain
25.	Shear Tension Of Lead-free Solder Joints Creep Resistance Strain Relations
26.	Influence Of Protective Atmosphere On The Microstructure And Properties Of Lead-free Solder Joints
27.	Research On Thermomigration In The Interconnection Solder Joints In High Density Electronic Packaging
28.	The Algorithm Research Of Automatic Optical Inspection For Solder Joints Based On Pattern Recognition Technology
29.	Research On The Thermal Fatigue Reliability And Interfacial Reactions Of Plastic Ball Grid Solder Joints
30.	Investigation On The Relationship Between The Microstructure Evolution Of The Intermetallic Compounds In Solder Joints And The Micro-and Macro-mechanical Behavior
31.	Research On Reliability Of PCB Lead-free Solder Joints In The Condition Of Thermal Shock
32.	The Electromigration Behavior Of Cu-cored Composite Solder Joints
33.	Research On BGA Snpb Solder Joints Reliability Under Various Impact Interface
34.	Simulation Of Electromigration And Size Effect On Interfacial Reaction In Lead-free Solder Joints
35.	Study On Dissolution Of Substrate In Lead-free Solder Joints Upon Electron Current Stressing
36.	Study Of Electromigration In Lead-free Solder Joints On Electroless Ni-P Substrate
37.	Study On The Reliability Of Military Electronic Modules’ Lead-free Solder Joint
38.	Study Of Microstructural Evolution Of Narrow Gap Cu/Sn-Cu-Ni-xRE/Cu Solder Joints And The Size Effect On Their Mechanical Properties
39.	Research Of Damage Characteristics About Lead-free Solder Joints Based On Impedance Method
40.	Research Of Electromigration Failure For Fcbga Solder Joints Under Multi-Physical Field
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