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Keyword [solder]
Result: 161 - 180 | Page: 9 of 10
161. Research On The Frequency Characteristic Of Lead-free Solder Joint Damage Under Stretch And Impact By Lab VIEW
162. BGA Solder Ball Height Real-time Inspection System Based On Timed Automata
163. Influence Of Rapid Thermal Fatigue On Property And Microstructure Of Lead-free Micro-solder Joint
164. Research On The Mechanical Properties Of Intermeallic Compound And Analysis Of Solder Joint Reliability In Electronic Packaging
165. Key Theories Research On Cone-Beam CT Image Reconstruction For SMT And BGA Solder Detection Algorithm
166. Thermal Failure Analysis And Optimization Design Of Microelectronic Packaging Device
167. Effects Of Mn Doping On Interfacial Reaction And Mechanical Properties Of Sn-0.3Ag-0.7Cu Lead-free Solder
168. Key Technologies Research On BGA Solder Joint’s Defect Detection Based On Precision Micro-focus X-ray
169. The Deformation Mechanism Of The IMCs’ Growth On The Solder/Substrate Interface
170. The Research About The Storage Failure Mechanism Of Assembly Solder Joint On Printed Circuit Board
171. Researh On The Packaging Characteristics Of Led Flip-Chips
172. Experimental Investigation Of The Mechanical Behavior Of IMC In Solder Joints Under Various Strain Rates
173. Dynamic Response And Failure Analysis Of Lead-Free BGA Package Under Drop Impact
174. Study On Packaging Technology Of High Power Single Emitter Semiconductor Laser
175. A Study Of Die Attach Solder Void’s Impact On Power MOSFET Device Characteristics
176. Study On Process Mechanics And Thermal Reliability Of PBGA Packages
177. Research On Reliability For Flip-chip Package And Through Silicon Via (TSV) In3D Package
178. Microstructure Of Lead-free And Tin-lead Mixed Solder Bump Research
179. Based On Image Processing PCB Solder Joint Defects Detection
180. A Study On The Fatigue Life Estimation Of Electronic Chip Solder Joints In The Harsh Environments
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