process development - Globe Thesis

Keyword [process development] Result: 41 - 59 \| Page: 3 of 3
41.	Electrical and material characteristics of hafnium-based multi-metal high-k gate dielectrics for future scaled CMOS technology: Physics, reliability, and process development
42.	Investigation of fabrication process development for integrated optical grating structures
43.	Aluminum gallium nitride/gallium nitride HEMTs for high-power applications: Transistor design issues and process development
44.	Hospital information systems development in Chinese hospitals: A process model
45.	Process development and optimization by simulations for the packaging of advanced optoelectronic devices
46.	Underfill process development for lead free flip chip assembly
47.	Towards a Secure Software Development Framework Based on an Integrated Engineering Process
48.	High-density plasma etching of III-nitrides: Process development, device applications and damage remediation
49.	New process development for flip chip assembly
50.	Process development, material analysis, and electrical characterization of ultra thin hafnium silicate films for alternative gate dielectric application
51.	Process development and device design for continued MOSFET scaling
52.	Amorphous ternary barriers (titanium silicon nitride) for copper/SiLK(RTM) metallization schemes: Process development and integration studies
53.	100-GHz enhancement and depletion mode MESFET MMIC process development
54.	Statistical process development and optimization of gallium arsenide MESFET-MSM optoelectronic integrated circuits
55.	Process discovery: Automated process development for the control of polymer curing
56.	Design for Implementation of Image Processing Algorithms
57.	Fabrication process development for high-purity germanium radiation detectors with amorphous semiconductor contacts
58.	Process Research And Circuit Implementation Of AC Direct LED Driver IC With High Output Power And Low Optical Flicker
59.	Package Structure Design And Process Development For MOSFET Chip Based On Molded Interconnect System Technology
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