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Keyword [pillar bump]
Result: 1 - 7 | Page: 1 of 1
1.
Research On MEMS Capacitive Pressure Sensors Based On Flip-Chip Technology
2.
Ic Package Cylindrical Copper Bump Coupled Field Numerical Study Of Atomic Migration
3.
Research On The Preparation And Performances Of Cu-pillar Bumps With Sn Cap In The Area Array Packaging
4.
Investigation Of Reliability For The Copper Pillar Bump Interconnection In The Flip Chip Packaging Under Thermal And Current Stressing
5.
Study Of IMC Growth And Control At Interface Of Micro Copper Pillar Bumps For High Density Package
6.
Effects Of Electrothermal Coupling On The Growth Of Intermetallic Compounds Of Copper Pillar Bump
7.
Study On Structure Design,process And Performance Of Wafer Level Copper Pillar Bump Packaging
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