Keyword [intermetallic compounds(IMC)] Result: 1 - 3 | Page: 1 of 1 1.  Investigation On The Relationship Between The Microstructure Evolution Of The Intermetallic Compounds In Solder Joints And The Micro-and Macro-mechanical Behavior 2.  The Creep Behaviors Of Lead-free Micro-solder Joints And The Growth Mechanism Of Tin Whisker On Coatings In Electronic Packaging 3.  Effects Of Nano-CeO2 Addition On Interfacial IMC Growth Of Sn-0.3Ag-0.7Cu-xCeO2/Cu Solder Joints   <<First  <Prev  Next>  Last>>  Jump to

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