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Keyword [intermetallic compound]
Result: 21 - 33 | Page: 2 of 2
21. Effect Of Diffusivity Anisotropy In β-Sn Grain On The Electromigration Behavior Of Micro-solder Joints
22. Thermodynamic Simulation Of Interconnected Area Of Printed Circuit In Manufacturing Process
23. Study On The Characteristics And Kinetics Of Ni-Sn TLPS Bonding Process
24. Microstructure Evolution And Reliability Analysis Of Cu/(Ni,Sn)/Cu,Ni/(Ni,Sn)/Cu,Ni/(Ni,Sn)/Ni And Si/(Ni,Sn)/Cu Joints During TLP Bonding
25. Electrodeposited Sn-TiO2 Composite Solder And Interface Reaction Of Solder Joints
26. Growth Behavior And Mechanism Of Intermetallic Compounds In Co-P/Solder Interface Under Temperature Gradient
27. Study On Low Temperature Cu-cu Bonding Based On Graphene/lead-free Solder
28. Research On Surface Treatment Technology Of Printed Circuit Board Interconnect Pattern And Its Signal Integrity
29. Study On The Controllable Generation And Performance Evolution Of Micro-interconnect Interfaces
30. Preparation And Characterization Of Full Cu6Sn5 IMC Micro-Joints
31. Research On Interfacial Reaction Of (111) Nanotwin Copper
32. Study On Mechanical Properties Of Sn-Bi-xIMC(Sn-Cu-Ni) Low Temperature Solder For Electronic Packaging
33. Electromagnetic Induction Heating Co/Sn Interface Reaction And Its Application To Micro-joint
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