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Keyword [interface delamination]
Result: 1 - 4 | Page: 1 of 1
1.
Numerical Simulation Study And Application Of Interface Delamination In High Density Electirc Packaging
2.
The Study Of Transfer Printing For The Microstructured Stamp In The Fabrication Of Micro-Nano Electronic Devices
3.
Research Of Mechanical Behavior Of Crack Initiation In Micro-electronic Package EMC-Cu Interface
4.
A Study On The Mechanical Behavior Of The Initiation And Propagation Of Cu-PDMS Interconnect Interface Delamination In Flexible Electronic Packaging
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