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Keyword [flip-chip equipment]
Result: 1 - 7 | Page: 1 of 1
1.
The Robust Control And Fuzzy Fine Tuning For Wafer Level Flip-chip Equipment Motion Platform
2.
Design And Application Of Vision System And Single-phase Current Driver For Wafer Level Flip-chip Packaging Equipment
3.
Vibration Suppression And Controller Design Of Servo Direct Drive Shaft In Wafer Level Flip-chip Equipment
4.
Servo System Position Control Of The Flip Chip Arms On A Flip Chip Bonder
5.
Research On Flip-chip Soft-landing Interconnection Based On Feed-force-sensing Fusion
6.
Sliding Mode Control Of Core Servo Axis In Advanced Packaging Flip Chip Equipment
7.
Research On Active Disturbance Rejection Control For Wafer Level Flip Chip Equipment Motion Platform
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