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Keyword [flip chip interconnection]
Result: 1 - 4 | Page: 1 of 1
1.
The Influence Of Microstructure And Grain Orientation On Lead-free Solder Joint's Reliability
2.
Signal Integrity Analysis Of High Speed Flip Chip Package Interconnection
3.
Self-Feedback Matching For Vision Alignment System In Wafer-Level Flip-Chip Packaging
4.
Design Of Millimeter-wave Wideband Semi-elliptic Slot Antenna In Package And Dual-polarized Antenna With High Isolation
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