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Keyword [flip chip]
Result: 101 - 120 | Page: 6 of 9
101.
Research And Optimization Of Thermal Congestion Effect Of High Power CSP White LED Flip Chip
102.
Research On Gold Bump Thermosonic Flip-chip Bonding Quality Control
103.
Reliability Research On Technology-Service Process Of Flip Chip Package Components
104.
Chip package interaction (CPI) and its impact on the reliability of flip-chip packages
105.
Flip chip and heat spreader attachment development
106.
Fundamental study of underfill void formation in flip chip assembly
107.
An experimental study of electromigration in flip chip packages
108.
Study on the nanocomposite underfill for flip-chip application
109.
Flip-chip technology and new microwave filters on coplanar strip lines
110.
Analysis and modeling of underfill flow driven by capillary action in flip-chip packaging
111.
Thermal and moisture induced failure analysis in the microelectronics packaging
112.
Assessment of the mechanical integrity of copper/low-k dielectric in a flip chip package
113.
A systems approach to ultra-fine pitch flip chip interconnect packaging
114.
Experimental study of void formation in solder joints of flip-chip assemblies
115.
Fluxless flip chip bonding processes and aerial fluxless bonding technology
116.
Predictive failure model for flip chip on board component level assemblies
117.
High conductivity composite flip-chip joints and silver-indium bonding to bismuth telluride for high temperature applications
118.
Silver flip chip interconnect technology and solid state bonding
119.
A novel conductive-polymer-based integration process for high-performance flip-chip packages
120.
Underfill process development for lead free flip chip assembly
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