Keyword [electronic package] Result: 21 - 35 | Page: 2 of 2 21.  Interfacial Stress Analysis Of Through Silicon Via 22.  Study Of Thermal-hygroscopic Mechanical Properties For PBGA Electronic Package Polymer And Its Packaging Reliability 23.  Theanalysis Of TSV-Cu’s Properties Based On Nanoindentation And Finite Element Simulation 24.  Research On Heat Dissipation Characteristics Of IGBT Module Package 25.  Study On Viscoplastic Behaviors And Failure Of Electronic Packages Under Therm-mechanical Loading 26.  Study On Thermal Resistance Of Power Electronic Package Based On The Finite Element Method 27.  Multi-physics Domain Optimization Design For 28nm IC Package System 28.  Research Of Mechanical Behavior Of Crack Initiation In Micro-electronic Package EMC-Cu Interface 29.  Application Study Of Six Sigma In Electronic Package Capacitor Solder Bridging Failure 30.  Die stress analysis in plastic encapsulated electronic packages: An experimental and numerical approach 31.  Development of silicon chemical wet etching toward the realization of an integrated thermal-electronic package 32.  A study of warpage of electronic package and effect of reflow 33.  Mechanical Simulation Analysis Of System In A Package(SiP) With Electron-thermal-mechanical Effect 34.  Study On The Performance Of Epoxy Molding Compound For Semiconductor Devices 35.  Dynamic Modeling And Scale Control Of Dam Print-fill Process In Electronic Packaging Area   <<First  <Prev  Next>  Last>>  Jump to

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