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Keyword [diamond wire saw]
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1. Hydraulic Control & Observation System Research On Underwater Diamond Wire Saw
2. Wire Saw Cutting Of The Stress Field And The Damage Layer Of Monocrystalline Silicon
3. Mechanical Property Of Diamond Wire Sawn Multi-crystalline Silicon Wafers And Its Improvement
4. A Study Of The Surface Characteristics Of Diamond Wire Sawn Multicrystalline Silicon Wafers And The Texturization
5. The Surface Investigation Of Single Crystal SiC Sawed By Electroplated Diamond Wire
6. Study On The Performance Of Three-core Twisted Diamond Wire Saw Cutting Of Crystalline Silicon
7. Finite Element Analysis On Wafer Micro-crack Damage Layer Depth And Warp In Wire Saw Slicing SiC Crystal
8. The Research On The Fabrication And The Properties Of Diamond Wire Saw Multi-crystalline Black Silicon
9. Research On Nano Scratching And Chip Processing Performance Of Single Crystal Silicon
10. Study On The Surface Layer Crack Damage In Diamond Wire Sawing Of Single Crystal Silicon Carbide
11. Research And Design Of Wire Cutting Control System
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