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Keyword [bumps]
Result: 1 - 15 | Page: 1 of 1
1.
Electrodepostion Of Micro-bumps Applied To 3-d Electronic Package And Research On Low Temperature Solid State Interconnection Technology
2.
Research And Design Of Car Seat Bumps Motility Test Equipment Control System
3.
The Preparation Of High Performance Uncooled Pyroelectric Infrared Detectors
4.
The Research Of Real-time Scheduling Algorithm Under Sigle Processor Environment
5.
Research On The Preparation And Performances Of Cu-pillar Bumps With Sn Cap In The Area Array Packaging
6.
Study On The Process And Reliability Of 3D Packaging
7.
Study On Micro-bumps Welding Of Flip Chip And Finite Element Simulation Of Solder Joint Strain
8.
Study On Failure Mechanism And Reliability For Micro-bump Interconnection Under Thermo-electric Stresses
9.
Study Of IMC Growth And Control At Interface Of Micro Copper Pillar Bumps For High Density Package
10.
Broadband Modeling Of TSV Considering Bumps
11.
Effects Of Electrothermal Coupling On The Growth Of Intermetallic Compounds Of Copper Pillar Bump
12.
Analysis and modeling of underfill flow driven by capillary action in flip-chip packaging
13.
Experimental study of void formation in solder joints of flip-chip assemblies
14.
Fluxless flip chip bonding processes and aerial fluxless bonding technology
15.
Study On The Formation Of Sidewall Intermetallic Compounds In Micron-Level Copper Pillar Bumps
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