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1.
Millimeter-wave Ltcc Packaging Technology Research
2.
Research On Microwave Passive Circuit Based On SiP Technology
3.
Research On Microwave Multilayer Differential Filters With Hybrid Microstrip-Line And Slotline Structure
4.
Research On Miniaturization Of Microwave Wideband Receiving Frontend
5.
Research On Technology Of RF Wideband Transceiver Front-End Based On SIP
6.
Design And Fabrication Of SIW Filter Based On LTCC Technology
7.
The Research On X-Band Receiver Module Design Based On 3D Intergration Technology
8.
Design And Implementation Of Key Technology For Internal Calibration Of Tile Type Phased Array
9.
Design Of T/R Component System Based On W Band SOC Radio Frequency Chip
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