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Keyword [Through-wafer]
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1. Study On Wafer-level Chip Scale Package For MEMS
2. Capacitive micromachined ultrasonic transducers with through-wafer interconnects
3. Developing through-Wafer via (TWV) and Plasma Dicing Process for Silicon Interconnect Fabric (Si-IF
4. Low-loss on-chip interconnects for silicon integrated radio-frequency and microwave systems
5. Through wafer 3D Vertical Micro-Coaxial Probe for high frequency material characterization and millimeter wave packaging systems
6. Electrical through-wafer interconnects for integrated sensors and actuators
7. Electrical through-wafer interconnects and microfabricated cantilever arrays using through-wafer silicon etching
8. Through-wafer three-dimensional micromachining and its applications for neural interfaces and microrelays
9. Through-wafer interrogation of MEMS device motion
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