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Keyword [Three-dimensional integrated circuits]
Result: 41 - 56 | Page: 3 of 3
41.
Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits
42.
Electrothermal Analysis of Three-Dimensional Integrated Circuits
43.
Nanopattern-guided growth of single-crystal silicon on amorphous substrates and high-performance sub-100 nm thin-film transistors for three-dimensional integrated circuits
44.
Glass microbump bonding method for high frequency three-dimensional integrated circuits
45.
Analytical and experimental investigation of thermal transport in three-dimensional integrated circuits (3D ICs)
46.
Research On The Characteristics Of TSV Inductors In The Case Of Multi-physics Coupling
47.
Three-dimensional Integration Thermal Management And Chip-level Thermal Stress Modeling And Simulation
48.
Signal Integrity Analysis Of Through-Silicon Vias (TSV) Filled With Carbon Nanotubes For 3-D ICs
49.
Study On TSV Coupling Crosstalk And Its Optimization
50.
Research And Implementation Of Key Techniques In 3D Clock Tree Synthesis For Noise Avoidance
51.
Analysis Of Electrothermal Characteristics Of Carbon Nano Interconnect Structure
52.
Research On The Noise Characteristics Of Power Distribution Networks In Three-Dimensional Integrated Circuits
53.
Research On Millimeter Wave Interdigital Bandpass Filter Based On TSV
54.
Research On High Performance Compact Power Divider Based On TSV
55.
Study Of Reflectionless Filters Based On TSV
56.
Thermal Analysis And Optimization Study On Three-dimensional Stacked Chip With Irregular Structures
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