Three-dimensional integrated circuits - Globe Thesis

Keyword [Three-dimensional integrated circuits] Result: 21 - 40 \| Page: 2 of 3
21.	Analysis And Design Of Through Silicon Via-Based Power Delivery Network In 3D ICs
22.	Analysis And Optimization Of Electrothermal Characteristics Of Through-silicon Vias In 3D Integrated Circuits
23.	Research On Optimization Of Testing Cost Of 3D-SIC
24.	Research On Die To Die Interconnects Test Methods For Three Dimensional Integrated Circuit
25.	Design And Analysis Of TSV-Based 3-D ICs And Passive Devices
26.	Research On 3D Memory Built-In Self-Repair Technology And TSVs Fault-Tolerance
27.	Analysis Of IR-drop In PDN Of Three-Dimensional Integrated Circuits
28.	A Study On The TSV Filter Design And Characteristic Analysis
29.	Modeling,Design And Optimization Of Differential Transmission Structure In 3-D ICs
30.	Micronetworking: Reliable communication on three-dimensional integrated circuits
31.	Design exploration for three-dimensional integrated circuits (3DICs)
32.	Thermo-mechanical reliability of micro-interconnects in three-dimensional integrated circuits: Modeling and simulation
33.	Physics and technology of low temperature germanium MOSFETs for monolithic three dimensional integrated circuits
34.	High-performance germanium-on-insulator MOSFETs for three-dimensional integrated circuits based on rapid melt growth
35.	High performance caches and interconnects for many-core and three-dimensional integrated circuits
36.	Interconnect-based design methodologies for three-dimensional integrated circuits
37.	Optimal signal, power, clock and thermal interconnect networks for high-performance two-dimensional and three-dimensional integrated circuits
38.	Thermal analysis and multiobjective optimization for three dimensional integrated circuits
39.	Enhancing Power and Signal Integrity in Three-Dimensional Integrated Circuits
40.	System and Gate-level Dynamic Electrothermal Simulation of Three Dimensional Integrated Circuits
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