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Keyword [Thermal Cycle]
Result: 1 - 11 | Page: 1 of 1
1.
The Reliability Analysis And Structure Parameter Opimization Of Stacked Die Package
2.
Finite Element Simulation And Life Prediction For Reliability Of Lead-free Solder In PBGA
3.
The Three-Dimension FE Fracture Analysis Of Ball Grid Array Packaging Under Cycle Temperature Load
4.
Temperature Cycling Reliability Of Plastic Packages Ball Grid Array Study
5.
Plastic Ball Grid Array Package (pbga) Mechanical Properties Under Different Loading Conditions And Optimization Analysis
6.
Shear Resistance Strain Of The Solder Joints Under Tensile And Temperature Cycling Conditions
7.
The Design Of Weld Thermal Cycle Testing Portable Device Based On ARM9
8.
Temperature Control System Of Thermal Cycle Based On PLC
9.
Simulation Investigation On Solder Joint Reliability Under Vibration Or Thermal Cycling For PBGA Package
10.
Study On The Viscoplasticity Of Sn3.0Ag0.5Cu And Reliability Of The POP Package Under Thermal-Vibration Load
11.
Modal Experiment And Numerical Simulation Of PCB Assembly
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