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Keyword [THREE-DIMENSIONAL PACKAGING]
Result: 1 - 14 | Page: 1 of 1
1.
Research On The Packaging Technology For Integrated Power Electronics Module
2.
Micro Inertial Device Of Three Dimensional Packaging Design And Implementation
3.
Flectromagnetic Analysis And Design Of3D Packaging For High-speed Circuits
4.
Research On Multilayer Stack Bonding Technology For System In Package
5.
Research On Low Temperature Thermo-compression Bonding Technology Using Nanoporous Copper As Bonding Layer
6.
Research On Feature Recognition Method Of Typical Defects In TSV Three-Dimensional Packaging
7.
Study Of Micron Silver/Copper Particles Reinforced Tin-based Solder
8.
Alternative processing methods for copper through silicon vias for three-dimensional packaging
9.
Advanced three-dimensional packaging schemes for microelectronic and microsystem applications
10.
Study On Modification And Reliability Of 3D Package Sn Solder Doping Micro-nano Al
11.
Reliability Simulation And Life Prediction Of TSV Structures Under Multi-stress Coupling
12.
Three-Dimensional Packaging Thermal Structure Design And Shielding Effectiveness Analysis Of MEMS Piezoelectric Sensor
13.
Design And Optimization Of Three Dimensional Stacked Packaging Structure For Memory Chips
14.
Key Technologies Research On 3mm Miniaturized Multi-channel Transceiver Module
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