Font Size:
a
A
A
Keyword [Stress intensity]
Result: 1 - 7 | Page: 1 of 1
1.
Study On Modeling And Simulation For Uniaxially Strained Si NMOSFET
2.
Viscoelastic Fracture Research Of Flip Chip
3.
Treatment Of Singularities In Boundary Integral Equation And Its Application In Fracture Mechanics
4.
The Research Of Cutting LCD-glass With Thermal Cracking Method Based On Thermal Weight Function Technology
5.
Research On Dicing Of Glass/Silicon Multilayer Bonding Plate Based On Laser Induced Thermal-crack Propagation
6.
Study On Processing Technology And Mechanism Of Laser Thermal Cleavage Wafer Under Water Cooling
7.
Plane Grid Generation And Dynamic Response Analysis Based On A Structure Analysis Software SASS
<<First
<Prev Next>
Last>>
Jump to
