Packaging reliability - Globe Thesis

Keyword [Packaging reliability] Result: 1 - 20 \| Page: 1 of 1
1.	Thermal-Mechanical And Hygroscopic Characteristics Of Micro-electronic Packaging Polymer And Its Packaging Reliability Study
2.	A Study On Interface Failure Analysis And Reliability For High Temperature Electronic Packaging
3.	Finite Element Simulation And Life Prediction For Reliability Of Lead-free Solder In PBGA
4.	Research On The Process And Reliability Of RFID Tag Packaged By ACA
5.	Surface Mount Technology And Printed Circuit Board Electrical Interconnection Reliability Research
6.	Study On Coupling And Packaging Between Polymer-based Optical Waveguides And Fibers
7.	Reliability Analysis Of Three Packaging Modules Using A Multi-physics Coupling Method
8.	Plastic Reliability. Computer-aided Statistical Analysis
9.	Copper Wire Packaging Reliability Research
10.	Study Of Thermal-hygroscopic Mechanical Properties For PBGA Electronic Package Polymer And Its Packaging Reliability
11.	Mixed Multi-physics Simulation Method And Its Application In Reliability Studies Of Package
12.	The Study On Reliability Of Three-dimensional Stacked Die Package
13.	Researches On Thermal Reliability And Relative Equipment Of Electronic Component
14.	Research On The Failure Mechanism And Reinforcement Technology Of An IC Chip
15.	Thermal deformation of electronic packages and packaging effect on reliability for copper/low-k interconnect structures
16.	Development of advanced packaging, fabrication and reliability methods for subminiature implantable neural prostheses
17.	Study On Evaluation And Improvement On Packaging Performance Of Multi-chip SiC IGBT Device
18.	Packaging Reliability Enhancement Of An Insulated-Gate-Bipolar-Transistor Module
19.	Design And Optimization Of Three Dimensional Stacked Packaging Structure For Memory Chips
20.	Warpage Analysis And Optimization Of Large Size Fan-Out Panel Level Package(FOPLP)
<<First <Prev Next> Last>> Jump to