Packages - Globe Thesis

Keyword [Packages] Result: 81 - 100 \| Page: 5 of 6
81.	Material characterization of thin coatings and failure analyses of flip-chip packages
82.	Underfill adhesion characteristics, residual stresses and analysis of thermal stresses in flip-chip packages
83.	Automated robotic inspection system for electronic manufacturing
84.	Methodologies for modeling simultaneous switching noise in multi-layered packages and boards
85.	An evaluation of feed-forward, back-propagation neural networks for optimal design of structural systems and for modular analysis of electronic packages
86.	Analysis of the relationship between peel and burst test results for peelable flexible packages
87.	Modeling and simulation of planes in electronic packages
88.	Partitioned analysis and approximations in optimization of mechanical systems: A focus on electronic packages
89.	Nonlinear stress analysis of electronic packages
90.	Development of microwave and millimeter-wave pin grid array and ball grid array packages
91.	An integrated process modeling methodology and module for sequential multilayered high-density substrate fabrication for microelectronic packages
92.	A comparison between deterministic and probabilistic thermal fatigue modeling of wires and wire bonds in microelectronic packages
93.	Inspection of defects in the seal region of flexible food packages using the ultrasonic pulse-echo technique
94.	Characterization of high-speed electronic packages using reduced-order partial element equivalent circuit models
95.	An investigation of interconnect geometry and fatigue life of ball-grid array electronic packages
96.	Real time optimization of chemical processes: A comparison of closed versus open form equations using commercial simulation packages
97.	The design of knowledge-rich browsing interfaces for retrieval in digital libraries
98.	Monolithic etched-facet triangular waveguide diode ring laser arrays for hybrid optical packages using passive alignment
99.	Optimal pin-assignment for signal integrity optimization in IC packages and connectors
100.	Modeling and simulation of electromagnetic wave propagation in electronic packages
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