Packages - Globe Thesis

Keyword [Packages] Result: 61 - 80 \| Page: 4 of 6
61.	Design and experimentation of composite packages for optical sensor to measure strain in mechanical structures
62.	VLSI layout design and digital simulation using Microsoft Excel
63.	Chip package interaction (CPI) and its impact on the reliability of flip-chip packages
64.	Finite element modeling on electromigration of solder joints in wafer level packages
65.	Development of Liquid Crystalline Polymer (LCP) surface mount packages for Ka-band applications
66.	An experimental study of electromigration in flip chip packages
67.	Die stress analysis in plastic encapsulated electronic packages: An experimental and numerical approach
68.	Damage prediction of lead free ball grid array packages under shock and drop environment
69.	Development and analysis of comprehensive website software test plan information packages
70.	Design of high speed packages and boards using embedded decoupling capacitors
71.	Escape routing studies in high input -output count area array packaging
72.	Investigation and prediction of solder joint reliability for ceramic area array packages under thermal cycling, power cycling, and vibration environments
73.	Dynamic Analysis for JavaScript Cod
74.	Development of monolithic silicon-germanium and packages RF MEMS high-linearity five-bit high-low pass phase shifters for SOC X-band T/R modules
75.	Integrated antennas on organic packages and cavity filters for millimeter-wave and microwave communications systems
76.	Thermal deformation of electronic packages and packaging effect on reliability for copper/low-k interconnect structures
77.	Assembly, reliability, and rework of 0.4 mm pitch wafer level chip scale packages
78.	Radio frequency identification transponder performance on refrigerated and frozen beef loin muscle packages
79.	A novel conductive-polymer-based integration process for high-performance flip-chip packages
80.	Electromagnetic coupling in multilayer thin-film organic packages with chip-last embedded actives
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